모델 번호
IR PRO SC bga equipment
사용법
for reworking motherboards of computers , notebooks,game players, etc.
Chip can be repaired
CBGA,CCGA,CSP,QFN,MLF,PGA,uBGA
Motherboard can be repaired
Notebook,desktop,switch,XBOX360,PS3
Dimensions
L475mm *W480mm *H420mm
Comsumption of upper heating
80mm*80 mm
Size of upper heating
80mm*80mm
Size of bottom heating
260mm*245mm